Buy Mil Spares is your sourcing solution for top-quality military and defense parts, aerospace parts, and other similar products that are necessary for operational fulfillment. You have reached the RFQ page for part number M393B2G70BH0-CK0, a Microcircuit Memory item that is listed with the NSN 5962-01-660-9528 for an ease of identification. Manufactured by Samsung America Inc and readily available for procurement today, you are always welcome to request a quote on this NSN part to receive tailored pricing information and fulfillment options from our team. Simply offer us important information like your desired quantity, price, and fulfillment timeframe, and our team will supply you with a tailored quote on part number M393B2G70BH0-CK0 in 15 minutes or less.
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To ensure that customers quickly identify and procure exact items, we list everything with as much relevant information as possible. For example, while part number M393B2G70BH0-CK0 is manufactured by Samsung America Inc, it is specifically done so under CAGE Code 0H108, a unique identifier assigned to a specific facility by the DLA that supplies to various government or defense agencies. Furthermore, using the first digits of the NSN 5962-01-660-9528, one can also determine that this part falls under FSC 5962 Microcircuits Electronic. With this in mind, continue exploring our website today, and see how we can help you secure competitive pricing and rapid lead times on all desired NSN parts.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-660-9528 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 016609528 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| M393B2G70BH0-CK0 | 5 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | Overall Height | 4.0 MILLIMETERS MAXIMUM |
| CZER | Memory Device Type | RAM |
| AFGA | Operating Temp Range | +0.0 TO 85.0 DEG CELSIUS |
| CXCY | Part Name Assigned By Controlling Agency | DDR3 SDRAM MEMORY |
| CZES | Hybrid Technology Type | MULTICHIP |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND ELECTROSTATIC SENSITIVE |
| CQSZ | Inclosure Configuration | PIN GRID ARRAY |
| MRC | Decoded Requirement | Clear Text Reply |
| TTQY | Terminal Type And Quantity | 240 PIN |
| ABHP | Overall Length | 133.20 MILLIMETERS MINIMUM AND 133.50 MILLIMETERS MAXIMUM |
| AGAV | End Item Identification | 518251-03 ASSEMBLY |
| CZZZ | Memory Capacity | 16GB |
| CZEN | Voltage Rating And Type Per Characteristic | 1.5 VOLTS NOMINAL ABSOLUTE INPUT |
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